SMT/PCBA/OEM大廠-竣晟科技JST

Reliable equipment that keep up with the times

At present, wehave two SMT production lines, one DIP production line and one production line for testing, assembly and packaging, respectively. The orders for multiple varieties with small production amountand mass production products are all based on customer’s needs and the flexible delivery date is 5~10 days after the required materials are ready.

We can cooperate with customers to obtain the UL, TUV, ETL, 3C, BIS product certifications.

Introduction of SMT production line

E BY DEK

Automatic solder paste printing machine

TRI, SPI

2.5D automatic optical solder paste inspection machine

SANYO TCM-3000high-speed machine

2 sets of 0.1 Sec/Chip

SAMSUNG,CP-45 NEO

It can perform 0.4 Pitch mounting, 0402 chip, QFP, BGA (corresponding to the Feeder and AUTO TRAY packaging).

Panasonic NPM-W2 general machine

It can perform 0.2 Pitch mounting, high-resolution 3D camera (corresponding to the Feeder and AUTO TRAY as well asthe tubular materials, pin type materialsmounting)

SANYO, TCM-X100 high-speed machine,

(magnetic levitation type) 0.075 sec/Chip, can perform 0201 CHIP high-precision mounting.

BTU Pyramax 98

The nitrogen reflow welding furnace with lead-free manufacturing process

AOI 2D

Automatic optics inspection machine.

X-RAY 6600

X-RAY inspection machine.

SAWA SC-AD145

Fab foundry-level steel plate cleaning machine

SMT production line

One production line each for the plug-in and assembly packaging, respectively; the operation is based on the actual needs of customers
Cutting board → plug-in → tin furnace → tin surface trimming → testing → assembly → packaging

It is used in industrial computer, medical, photoelectric and communication products

Assembly (line materials, heat dissipation plate, mechanism material assembly)

Test station (power on, full function)

Packaging of finished products

Production line-system assembly

Panel processing

Panel cleaning

Assembly production line for system products

Test station (T0 test)

Burn-in room

Burn-in (T1 test) operation

Functional test (T2.T3) operation

Inspection machine for packaging weight

Biotechnology Engineering

The company's engineering teams have extensive experience and they are responsible for improvement of manufacturing process, SOP and fixture development and production, and technical transfer support.

Multiple sets of equipment such as BGA maintenance and oscilloscope are also available for BGA ball installation and maintenance in the related industrial, optoelectronics, medical care and communications products.